Electrical Components White Papers

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Cutting Edge Multicore Development Techniques for the Next Wave of Electronics Products
sponsored by IBM
WHITE PAPER: As more and more software is embedded into both consumer and industrial electronics, the electronics industry is being challenged with ensuring rigor within its software development process, often a new core competency, and the integration of hardware and software. Read this paper to learn about solutions that address these complex challenges.
Posted: 01 Sep 2010 | Published: 19 Mar 2010

IBM

Built-in Self-test (BIST) Using Boundary Scan
sponsored by Texas Instruments, Inc.
WHITE PAPER: This document shows how existing architectures can be modified to conform to IEEE 1149.1 architecture.
Posted: 09 May 2000 | Published: 01 Dec 1996

Texas Instruments, Inc.

5 Reasons Environmental Sensors are used in all Modern Data Centers
sponsored by Raritan Inc.
WHITE PAPER: This whitepaper offers five reasons you should consider implementing environmental sensors in your data center.
Posted: 25 Mar 2014 | Published: 25 Mar 2014

Raritan Inc.

Prepare, predict, pinpoint: HP Operations Analytics
sponsored by Hewlett Packard Enterprise
WHITE PAPER: In this white paper, discover the best way to manage all of this data: by exploiting big data management and analytics. Read on now to learn about one standalone solution that offers the means to collect and analyze huge data volumes from multiple perspectives, and provides tremendous opportunities to IT operations.
Posted: 21 Feb 2014 | Published: 31 Dec 2013

Hewlett Packard Enterprise

FIFO Solutions for Increasing Clock Rates and Data Widths
sponsored by Texas Instruments, Inc.
WHITE PAPER: Steady increases in microprocessor operating frequencies and bus widths over recent years have challenged system designers to find FIFO memories that meet their needs.
Posted: 13 Apr 2000 | Published: 01 Jan 1996

Texas Instruments, Inc.

IBM System x3650 M4 Servers Data Sheet
sponsored by IBM and Intel.
WHITE PAPER: Explore this datasheet to learn about a scalable server package that can save your enterprise money without sacrificing speed or availability.
Posted: 07 Jul 2014 | Published: 14 Sep 2013

IBM and Intel.

Oracle Exalogic Elastic Cloud: System Overview
sponsored by Oracle Corporation
WHITE PAPER: Read this white paper to learn about Oracle Exalogic Elastic Cloud, an Engineered System consisting of software, firmware, and hardware designed to meet the highest standards of reliability, serviceability and performance.
Posted: 09 Apr 2012 | Published: 15 Sep 2011

Oracle Corporation

Bringing Order to IT Chaos in Remote Offices
sponsored by DELL & INTEL
WHITE PAPER: Take a look at this exclusive resource to find out how this converged infrastructure hardware can help you enable business success.
Posted: 18 Feb 2014 | Published: 30 Jun 2013

DELL & INTEL

Reduce data center complexity when you 'go virtual'
sponsored by HPE and Intel®
WHITE PAPER: Access this exclusive, in-depth resource to find out how HP's latest solution for virtual environments can benefit your organization.
Posted: 04 Mar 2014 | Published: 31 Dec 2013

HPE and Intel®

Gartner Report: Dell's Data Center Strategy: From Chassis to Fabric-Based System
sponsored by Dell, Inc. and Intel®
WHITE PAPER: This resource details a fabric-based infrastructure solution that optimizes data center efficiency and agility. Uncover the impacts and recommendations when considering a converged infrastructure strategy for your IT environment.
Posted: 09 Oct 2012 | Published: 30 Jun 2012

Dell, Inc. and Intel®